Cisco Technical Leader, Optics in Vimercate, Italy

Technical Leader, Optics

  • Location: Vimercate, Lombardia, Italy

  • Additional Location(s) Nuremberg, Germany

  • Area of Interest Engineer - Hardware

  • Job Type Professional

  • Technology Interest *None

  • Job Id 1236147

What You'll Do:

  • Leading Photonics Package design, architecture and assembly flow selection and qualification for current and future Cisco Photonics Products

  • Drive Photonics integration technology development roadmaps, support Design Engineering teams toward optical integration designs and assembly flows, and qualification of various optical sub-assemblies and final module.

  • Own supplier side technology development, process development, production readiness, processtroubleshooting and issue resolution, as well as process qualification and audits

  • Technical capability evaluation and technical selection of OSATs, CMs and other assembly houses. Also work with research institutes and organizations to lead research and development activities in Photonics packaging

  • Assess reliability risks, develop and execute to Product Qualification plans and resolve technical issues, including failure analysis and model based problem solving

  • Lead Photonics packaging scale up, technology transfer to volume manufacturing and process health indicators to monitor Cpks and overall health of the optical assembly process in Production

Who You’ll Work With:

  • This is a supplier facing, technical leadership role that requires close engagement with Cisco design, engineering, Product Operations and Global Supply Management teams to drive Photonics Packaging technology integration into various Optics Products.

Who You Are:

  • Experienced in Photonics packaging, including III-V material packaging, chip/wafer assembly processes, flip chip bonding, substrate design and knowledge of state of the art assembly processes and tools

  • Possesses expertise in optical coupling, especially fiber coupling process development, various fiber coupling designs, epoxies, and other optical component integration (e.g. lenses, prisms etc.)

  • Deep understanding of wafer/chip level packaging and III-V chip packaging challenges, including stress management, warpage handling, solder joint failures etc. as well as good knowledge of various failure analysis techniques

  • Understanding and some experience withopto-mechanical modeling, such as stress modeling, Zemax ray tracing simulations, Optical coupling simulations, thermal modeling etc.

  • Possess a good understanding of Optical transceiver assembly & development, and overall Optical packaging supplier ecosystem, emerging suppliers and industry roadmap

  • Demonstrated ability in working withcross-functional teams, across varied geographical sites, and with external assembly houses, materials suppliers and other component vendors

  • Good communication skills, project management and team influencing skills

Qualification s:

Masters or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or other related discipline (or equivalent experience) with 10+ years experience in Optical or Semiconductor processes, packaging or design.

Why Cisco

At Cisco, each person brings their unique talents to work as a team and make a difference.

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  • We benefit everyone - We do all of this while striving for a culture that empowers every person to be the difference, at work and in our communities.

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